TIC800A Manufacture 2.5W Low Melting Point Thermal Interface Materials Thermal Phase Changing Material
The TIC™800A series is low melting point thermal interface material. At 50℃, TIC™800A series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.
TIC™800A series is a flexible solid at room temperature and free standing without reinforcing components that reduce thermal performance.
TIC™800A Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration(pump out)at operating temperatures.
Features
> 0.018℃-in²/W thermal resisitance
> Naturally tacky at room temperature,no adhesive required
> No heat sink preheating required
Applications
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components
> IT infrastructure
> GPS navigation and other portable devices
| Typical Properties of TIC™800A series |
| Product Name | TIC™805A | TIC™808A | TIC™810A | Test Method |
| Color | Gray | Visual |
| Thickness | 0.005"/0.126mm | 0.008"/0.203mm | 0.010"/0.245mm | ****** |
| Thickness Tolerance | ±0.0008"/±0.019mm | ±0.0008"/±0.019mm | ±0.0012"/±0.030mm | ****** |
| Density | 2.5 g/cc | Helium Pycnometer |
| Temperature range | -25 to 125℃ | ****** |
| Phase Change Softening Temperature | 50℃-60℃ | ****** |
| Thermal conductivity | 2.5W/mK | ASTM D5470 |
| Thermal Impedance@50psi(345KPa) | 0.055℃-in²/W 0.35℃-cm²W | 0.062℃-in²/W 0.40℃-cm²W | 0.074℃-in²/W 0.48℃-cm²W | ASTM D5470 |
Standard Thicknesses:
0.005"(0.126mm) ,0.008"(0.203mm), 0.010"(0.254mm)
Consult the factory alternate thickness.
Standard Sizes:
10" x 16"(254mm x 406mm) , 16"x400(406mm x 121.92m)
TIC800A series are supplied with a white release paper and a bottom liner.
TIC800A series is available in kiss cut an extended pull tab liner or individual die cut shapes.
Peressure Sensitive Adhesive:
Peressure Sensitive Adhesive is not applicable for TIC800A series products.
Reinforcement:
No reinforcement is necessary.
Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in Vietnam.
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: How do I request customized samples?
A: To request samples, you can leave us message on website, or just contact us by send email or call us.
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
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TIC800A Manufacture 2.5W Low Melting Point Thermal Interface Materials Thermal Phase Changing Material Images
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