TIC800G Manufacture Low Thermal Resistance 5.0W Low Melting Point Thermal Phase Changing Material
TIC™800 series is low melting point thermal interface material. At 50℃,TIC™800 series begins tosoften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuitpackage surface,thereby reducing thermal resistance.
TIC™800 series is a flexible solid at roomtemperature and freestanding without reinforcing components that reduce thermal performance.
TIC™800 Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500cycles, from -40℃ to 125C.The material softens and does not fully change state resulting in minimalmigration (pump out)at operating temperatures.
Features
> 0.014℃-in²/W thermal resisitance
> Naturally tacky at room temperature,no adhesive required
> No heat sink preheating required
Applications
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components
> IT infrastructure
> GPS navigation and other portable devices
| Typical Properties of TICTM800G Series |
| Product Name | TICTM805G | TICTM808G | TICTM810G | TICTM812G | Test Method |
| Color | Gray | Gray | Gray | Gray | Visual |
| Thickness | 0.005" | 0.008" | 0.010" | 0.012" | **** |
| (0.126mm) | (0.203mm) | (0.254mm) | (0.305mm) |
| Thickness Tolerance | ±0.0005'' | ±0.0008'' | ±0.0010'' | ±0.0012'' | **** |
| (±0.127mm) | (±0.203mm) | (±0.0254mm) | (±0.0305mm) |
| Density | 2.6g/cc | Helium Pycnometer |
| Temperature range | -40℃～125℃ | **** |
| Phase Change Softening Temperature | 50℃~60℃ | **** |
| Thermal Conductivity | 5.0 W/mK | ASTM D5470 (modified) |
| Thermal Impedance @ 50 psi(345 KPa) | 0.014℃-in²/W | 0.020℃-in²/W | 0.024℃-in²/W | 0.028℃-in²/W | ASTM D5470 (modified) |
| 0.09℃-cm²/W | 0.13℃-cm²/W | 0.15℃-cm²/W | 0.18℃-cm²/W |
Standard Thicknesses:
0.005"(0.127mm) ,0.008"(0.203mm), 0.010"(0.254mm),0.012"(0.305mm)
Consult the factory alternate thickness.
Standard Sizes:
10" x 16"(254mm x 406mm) , 16"x400(406mm x 121.92m)
TIC™800G series are supplied with a white release paper and a bottom liner.
TIC™800G series is available in kiss cut an extended pull tab liner or individual die cut shapes.
Peressure Sensitive Adhesive:
Peressure Sensitive Adhesive is not applicable for TIC™800G series products.
Reinforcement:
No reinforcement is necessary.
Company Profile
Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in Vietnam.
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: How do I request customized samples?
A: To request samples, you can leave us message on website, or just contact us by send email or call us.
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
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TIC800G Manufacture Low Thermal Resistance 5.0W Low Melting Point Thermal Phase Changing Material Images
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